|The new generation of laser scribing machine YMS-50 is capable of scribing various |
silicon wafer, solar cell, ceramic wafer, thin metal sheet (~0.5 mm thick maximum),
etc., in industries of electronics, semiconductor and solar energy, etc..
It is designed by experts with professional features, such as excellent beam quality
and power stability, precise CNC worktable and efficient auto cooling system.
Some of the most important parts are manufactured in UK, US and Germany. Thanks
to the automatic control of the whole system, you can save more efforts on
the manufacturing, instead of how to operate and maintain the system.
Excellent beam quality and system reliability
High-speed scribing (up to 120 mm/s), very low-defective index,
Auto cooling system
Precise CNC worktable
Friendly man-machine interface and simple software operation
Laser medium: Nd 3+: YAG
Wavelength: 1064 nm (Invisible infrared)
Pump source: Kr lamp
Laser cavity: Ceramic
Modulated frequency: 0.5 - 50 k Hz
Beam power: Adjustable, max 80 W
Aiming laser: Red
Scribing speed: Adjustable, max 120 mm/ s
Max scribing depth: 1.2 mm
Min scribing line width: 0.02 mm
Scribing area: 100/ 200/ 305 mm
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